The product portfolio includes single-sided, double-sided and multilayer printed circuit boards and flexible circuits (Flex and Rigid-Flex).
Special materials such as aluminium or copper substrate, Teflon, high-frequency Rogers and others can also be used on request.
- 8 layers
- PCB thickness 1,2 mm
- BGA (0,5 mm raster)
- bond width 50 μm
- 50 μm insulation
- fine pitch
- ENIG
- PCB thickness 1,0 mm
- half holes (0.6 mm bore, 1.1 mm raster)
- BGA raster 0,5
- bond width 50 µm
- 50 μm insulation
- ENIG
- 6 layers
- PCB thickness 1,6 mm
- BGA (0,5 mm raster)
- edge plating
- ENIG
- winding on the inner and outer layers
- 4 layers
- PCB thickness 0,8 mm
- BGA (0,5 mm raster)
- bond width 50 μm
- 50 μm insulation
- fine pitch
- ENIG
- 4 layers
- PCB thickness 0,4 mm
- buried vias
- blind vias – both sides
- ENIG
- 12 layers
- PCB thickness 1,5 mm
- BGA
- fine pitch
- ENIG
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