ML6 board

ML6 board (multi-layer) for high-frequency modules

for high-frequency module

  • PCB thickness 1,0 mm
  • edge plating – half holes (hole 0,6 mm, raster 1,1 mm)
  • BGA raster 0,5
  • track width 50 µm
  • spacing 50 µm
  • ENIG