MAKING A CIRCUIT FIGURE

Copperpattern and etching

The complexity of the SBU/HDI boards requires the use of a laser illuminator to illuminate the circuit layout directly on the board.  The Schmoll MDI ST with Mirror Direct Imaging (MDI ST) allows extremely precise positioning of the top and bottom layers (+/-20µm) of the HDI circuit board.

The line from lamination to illumination is automated by BENMAYOR ROBOT’s robotic arm, reducing the chance of errors and increasing productivity.

The new DES line (2022) for Acid etching adds a third etch module for fine final etching using a mist, which minimises the difference between the foot and the head of the etched bond.

Devices:

  • BENMAYOR ROBOT + MDI ST- machine for photoresist and photo soldering coating illumination
  • DES line (DEVELOPING ETCHING STRIPPING)
  • DYNACHEM LAMINATOR – photoresist lamination
  • MEC – PRE TREATMENT – pre-treatment of panels before lamination
  • DYNACHEM COVER SHEET REMOVER – removing the protective film before unwinding/eating/scraping

Technical characteristics:

  • Maximum working format: 650mm x 750mm (26″ x 30″)
  • MDI ST loading accuracy: +/- 0,020mm
  • Light spectrum MDI ST: 365nm-405nm (4LEDs)
  • DES line bond/insulation: 50µm
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