Technology

Requirement attribute

Product capability

Board type

Single-sided, Double-sided, Multilayer, Flex, Rigid-Flex, Teflon, High Frequency, MetalCore

Basic material

  • FR4, FR4 Halogen free, CEM1, CEM3-Termal
  • Rogers, Taconic, PTFE, Arlon, Nelco, Polyimide

Number of conductive layers

Up to 26

Maximal working panel ( brutto )

457 x 610 mm (535 x 610 mm)

Total board thickness

0,2mm – 5,0mm

Inner layer thickness

0,05mm – 3,2mm

Minimal  line width, space

70 µm  ( 50 µm )

Copper foil thickness on outer layers

18 µm, 35 µm, 70 µm, 105 µm, 140 µm , 170 µm 210 µm, 400 µm

Copper foil thickness on inner layers

18 µm, 35 µm, 70 µm, 105 µm, 140 µm

Drilling diameters

0,1 mm – 6,4 mm

Metallization aspect ratio

12  : 1  (16 : 1)

Blind vias aspect ratio

1 : 1

Blind vias – burried vias, sequential build up  - aspect ratio

1 : 1

Solder resist

  • Green: matt, glossy
  • Black: matt, semi matt
  • White – for LED aplication
  •  Blue
  •  Red
  • Yellow

Minimal gap in fine pitch

60 µm

Legend print

  • White
  • Yellow
  • Black
  • Red
  • Blue
  • Green

Peelable resist

Green - RoHS, Blue

Tented via

by IPC-4761 typeIV, with solder resist

Filled via

with non conductive paste, by IPC-4761,type V,type VI and typeVII

Carbon print

40 Ohm +- 5%

Surface protections

  • HAL – Lead Free ( RoHS )
  • HAL with Tin – Lead
  •  Immersion Ni.Au ( ENIG )
  •  Immersion Ag
  •  OSP
  •  Galvanic Au ( Hard Gold )
  •  Immersion Sn

 

Mechanical tolerances

  • Routing +/- 0,1mm
  • Scoring +/- 0,1mm
  • Punching +/- 0,05mm

Etching tolerances

+/- 20%   ( +/- 10% )

Hole tolerances ( Plated, Non Plated )

IPC 6012C

Tolerances of PRESSFIT holes

+/- 0,05 mm

 

 

Special features

  • Blind via
  • Burried via
  • HBU/Sequential Technology: Blind over burried
  • PRESSFIT, PRESSFIT- with back drilling
  • Side plating - metal plating edges
  • Castellated holes ( half plated holes )
  • Jump scoring
  • Countersink ( plated and non plated holes
  • BGA raster 0,4 mm
  • 50 µm core
  • Special multilayer structures 
  • Multilayers with ROGERS material
  • Impedance controlled stack up, coupon and test report

Quality management

  • UL Conformance ( US, C )
  •  ISO 9001
  •  ISO 14000
  •  EMPB
  •  Electrical test
  • Microsection
  • AOI
  • X-Ray checking
  • Dimensional examination

 

Learn more about our technology

CAM data processing CNC drilling ML lamination Automated optical inspection
Photo imaging Copper electroplating Etching Solder resist
Surface finish E-test Mechanical process Laboratory