Surface finish
Final surface finishes
- ENIG deposit thickness: Au: min. 0,05 µm, Ni: min. 3,0 µm
- hard gold selective deposit, contact: Au deposit thickness: min. 0,2 µm (hard gold, alloyed with cobalt)
- Sn/Pb selective deposit (HAL with lead)
- Sn selective deposit (HAL lead-free)
- chemical tin process: Sn deposit thickness: 0,6 – 1,2 µm
- chemical nickel process
- OSP (Organic Surface Protection)
- chemical silver: Ag deposit thickness: 0,2 – 0,4 µm
- Note: Surface finish can be applied only on PCBs.
Equipment:
- automatic galvanic line for chemical Ni/Au and chemical Ag deposit
- automatic galvanic line for hard Ni/Au deposit
- combined manual OSP line
- Penta HAL lead-free machine
- Quicksilver HAL with lead