Surface finish

Final surface finishes

  • ENIG deposit thickness: Au: min. 0,05 µm, Ni: min. 3,0 µm
  • hard gold selective deposit, contact: Au deposit thickness: min. 0,2 µm (hard gold, alloyed with cobalt)
  • Sn/Pb selective deposit (HAL with lead)
  • Sn selective deposit (HAL lead-free)
  • chemical tin process: Sn deposit thickness: 0,6 – 1,2 µm
  • chemical nickel process
  • OSP (Organic Surface Protection)
  • chemical silver: Ag deposit thickness: 0,2 – 0,4 µm
  • Note: Surface finish can be applied only on PCBs.

 

Equipment:

  • automatic galvanic line for chemical Ni/Au and chemical Ag deposit
  • automatic galvanic line for hard Ni/Au deposit
  • combined manual OSP line
  • Penta HAL lead-free machine
  • Quicksilver HAL with lead

 

Final surface finishes