Technology
| Requirement attribute | Product capability |
| Board type | Single-sided, Double-sided, Multilayer, Flex, Rigid-Flex, Teflon, High Frequency, MetalCore |
| Basic material |
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| Number of conductive layers | Up to 26 |
| Maximal working panel ( brutto ) | 457 x 610 mm (535 x 610 mm) |
| Total board thickness | 0,2mm – 5,0mm |
| Inner layer thickness | 0,05mm – 3,2mm |
| Minimal line width, space | 70 µm ( 50 µm ) |
| Copper foil thickness on outer layers | 18 µm, 35 µm, 70 µm, 105 µm, 140 µm , 170 µm 210 µm, 400 µm |
| Copper foil thickness on inner layers | 18 µm, 35 µm, 70 µm, 105 µm, 140 µm |
| Drilling diameters | 0,1 mm – 6,4 mm |
| Metallization aspect ratio | 12 : 1 (16 : 1) |
| Blind vias aspect ratio | 1 : 1 |
| Blind vias – burried vias, sequential build up - aspect ratio | 1 : 1 |
| Solder resist |
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| Minimal gap in fine pitch | 60 µm |
| Legend print |
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| Peelable resist | Green - RoHS, Blue |
| Tented via | by IPC-4761 typeIV, with solder resist |
| Filled via | with non conductive paste, by IPC-4761,type V,type VI and typeVII |
| Carbon print | 40 Ohm +- 5% |
| Surface protections |
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| Mechanical tolerances |
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| Etching tolerances | +/- 20% ( +/- 10% ) |
| Hole tolerances ( Plated, Non Plated ) | IPC 6012C |
| Tolerances of PRESSFIT holes | +/- 0,05 mm
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| Special features |
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| Quality management |
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Learn more about our technology
| CAM data processing | CNC drilling | ML lamination | Automated optical inspection |
| Photo imaging | Copper electroplating | Etching | Solder resist |
| Surface finish | E-test | Mechanical process | Laboratory |