Blind holes and througholes

The THP 35 double vacuum chamber via filling machine was designed for PCB manufacturers involved in the production of high demanding HDI/SBU boards. Blind and through-hole holes are filled in one step.
This is made possible by a new type of filling head that achieves optimum filling by means of high vacuum pressure.


  • ITC Model: THP 35

Technical characteristics:

  • Aspect ratio: up to 40 : 1
  • Minimum plated bore: 0.1mm (0.004″)
  • Panel thickness: 0.30mm – 10mm (0.012″ – 0.400″)
  • Maximum working size: 610mm x 762mm (24″ x 30″)
  • Compressed air: 90 PSI