Intectiv
Technical Capacity Table
| Category | Description | Technical performance |
| Data | Gerber data (preferred) | Gerber 274-X, ODB++, Eagle, DXF, HPGL; |
| Printed circuit boards (pcb) | Technologies | HDI/SBU pcb VIPPO/POFV Radio frequency ( RF ) pcb Backplane pcb Thermally conductive pcb Power pcb Hybrid pcb Flex pcb Rigidflex pcb |
| Number of conductive and non-conductive layers | Maximum number of layers | Up to 36 layers |
| Working format | Maximum working format | 457mmx610mm- 18inx24in(535mmx610mm- 21inx24in) |
| Final pcb thickness | Minimum and Maximum | 0,2mm – 4,7mm |
| Thickness of inner layers | Minimum and Maximum | 0,05mm – 3,2mm |
| Degree of flatness pcb | Twist & Bow | <= 0,75% |
| Basic copper | External and internal | 1/4Oz(9um) to 11Oz(400um) |
| Basic materials – rigid circuits | FR4, Fr4- high Tg, FR4.1-Halogen Free, Non Ansi RF materials, ( ROGERS, TEFLON, ARLON..), CEM-1, CEM-3, CEM-3 Thermal, IMS-Al, IMS-Cu; | |
| Basic materials – flexible circuits | Polyimide base materials: KREMPEL Panasonic Protective materials: DuPoint | 25um,50um,75um (ED,RA Cu) 25um,50um,75um (ED,RA Cu) 25/25, 50/25; |
| CNC mechanical drilling | Minimum drilling diameter – through hole Minimum drilling diameter – blind holes Maximum drilling diameter – through hole | 0,15mm 0,125mm 6.5mm |
| CNC laser drilling | Minimum laser hole diameter Maximum laser hole diameter | 0,07mm 0,15mm |
| Tolerances of holes | Plated / Non-plated | IPC6012 ( latest version ) |
| Pressfit | Tolerance | +/-0.05mm |
| Blind holes | A/R | 1:1 |
| Stacked holes | A/R | 1:1 |
| Blind holes through buried holes | A/R | 1:1 |
| Metallization of holes | A/R | 1:12 ( 1:16 ) |
| Copper pattern | Minimum bond width and insulation | 0,07mm(0,0027in) (0,05mm(0,00196in)) |
| Etching | Tolerance | +/-20% ( +/-10% ) |
| Soldermask | Colours | Green: semi-matt, glossy; Black: semi-matt, extra matt; White: for LED applications Blue: half matt Red: half mat Yellow: semi-matt Orange: semi-matt FLEX |
| Minimum reflection of the soldermask | White, Black: 100 um Red, Blue: 80 um Other colours: 60 um | |
| Silkprint | Colours | White Yellow Black Red Blue Green |
| Peelable mask | Colour | Blue |
| Covered bores | Type | III, ( IPC4761 ) |
| Filled holes | Type | V, VII ( IPC4761 ) |
| Graphite | resistance | 40 Ohm+/-5% |
| Surface protection | HAL- Lead free HASL- with Tin lead ENIG OSP Immersion Ag Elyt. Ni/Au Hard EPIG ENEPIG Immersion Sn | 1-40 um max 1-40 um Ni.5um.Au.0,05-0,1um – Min.0,3um Au: 0,4um – 2um External contractor External contractor External contractor |
| Mechanical treatments | Tolerance | Milling: +/-0.1mm (+/-0.07) Scoring: +/-0.1mm Deep milling: +/-0,1mm Chamfering: +/-0.1mm |
| Special treatments | Technology | Edge plating Jump scoring Edge plating- half holes Pressfit with partially drilled hole ( backdrill) |
| Quality | Electrical test AOI test Impedance control Electrical strength test Thermal test (solder dip) Dimensional control Microsection – analysis Chemistry laboratory | Yes Yes Yes Yes Yes Yes Yes Yes |
| Standards and certificates | IPC UL ISO | IPC-A-600(latest version ) Class 2, 3 IPC6012 ( latest version ) Class 2, 3 E79481 ISO9001, ISO14000, ISO26000; |
