TECHNICAL

Capacities

Technical Capacity Table

CategoryDescriptionTechnical performance
DataGerber data (preferred)Gerber 274-X, ODB++, Eagle, DXF, HPGL;
Printed circuit boards (pcb)Technologies

HDI/SBU pcb

VIPPO/POFV

Radio frequency ( RF ) pcb

Backplane pcb

Thermally conductive pcb

Power pcb

Hybrid pcb

Flex pcb

Rigidflex pcb

PCBTypes

Single sided

Double sided

Multilayer

 

Number of conductive and non-conductive layersMaximum number of layersUp to 26 layers
Working formatMaximum working format457mmx610mm- 18inx24in(535mmx610mm- 21inx24in)
Final pcb thicknessMinimum and Maximum0,2mm – 4,7mm
Thickness of inner layersMinimum and Maximum0,05mm – 3,2mm
Degree of flatness pcbTwist & Bow<= 0,75%
Basic copperExternal and internal1/4Oz(9um) to 11Oz(400um)
Basic materials – rigid circuitsFR4, Fr4- high Tg, FR4.1-Halogen Free, Non Ansi RF materials, ( ROGERS, TEFLON, ARLON..), CEM-1, CEM-3, CEM-3 Thermal, IMS-Al, IMS-Cu; 
Basic materials – flexible circuits

Polyimide base materials:

KREMPEL

Panasonic

 

 

Protective materials:

DuPoint

 

25um,50um,75um (ED,RA Cu)

25um,50um,75um (ED,RA Cu)

 

 

 

25/25, 50/25;

CNC mechanical drilling

Minimum drilling diameter – through hole

Minimum drilling diameter – blind holes

Maximum drilling diameter – through hole

0,15mm

 

0,125mm

 

6.5mm

CNC laser drilling

Minimum laser hole diameter

Maximum laser hole diameter

0,07mm

0,15mm

Tolerances of holesPlated / Non-platedIPC6012 ( latest version )
PressfitTolerance+/-0.05mm
Blind holesA/R1:1
Stacked holesA/R1:1
Blind holes through buried holesA/R1:1
Metallization of holesA/R1:12 ( 1:16 )
Copper pattern Minimum bond width and insulation0,07mm(0,0027in) (0,05mm(0,00196in))
EtchingTolerance+/-20% ( +/-10% )
SoldermaskColours

Green: semi-matt, glossy;

Black: semi-matt, extra matt;

White: for LED applications

Blue: half matt

Red: half mat

Yellow: semi-matt

Orange: semi-matt FLEX

 Minimum reflection of the soldermask

White, Black: 100 um

Red, Blue: 80 um

Other colours: 60 um

 

SilkprintColours

White

Yellow

Black

Red

Blue

Green

Peelable maskColourBlue
Covered boresTypeIII, ( IPC4761 )
Filled holesTypeV, VII ( IPC4761 )
Graphiteresistance40 Ohm+/-5%
Surface protection

HAL- Lead free

HASL- with Tin lead

ENIG

OSP

Immersion Ag

Elyt. Ni/Au Hard

EPIG

ENEPIG

Immersion Sn

1-40 um max

1-40 um

Ni.5um.Au.0,05-0,1um

Min.0,3um

Au: 0,4um – 2um

External contractor

External contractor

External contractor

Mechanical treatmentsTolerance

Milling: +/-0.1mm (+/-0.07)

Scoring: +/-0.1mm

Deep milling: +/-0,1mm

Chamfering: +/-0.1mm

Special treatmentsTechnology

Edge plating

Jump scoring

Edge plating- half holes

Pressfit with partially drilled hole ( backdrill)

Quality

Electrical test

AOI test

Impedance control

Electrical strength test

Thermal test (solder dip)

Dimensional control

Microsection – analysis

Chemistry laboratory

Yes

Yes

Yes

Yes

Yes

Yes

Yes

Yes

Standards and certificates

IPC

UL

ISO

 

IPC-A-600(latest version ) Class 2, 3

IPC6012 ( latest version ) Class 2, 3

E79481

ISO9001, ISO14000, ISO26000;

Top