PLATING

Equipment

Devices:

  • galvanic line for panel plating
  • electroplating line for pattern plating
  • WISE desmear line (R-R projects)
  • WISE deburring line*

Technical characteristics:

  • DOW chemical copper
  • Atotech TLC electrolytic copper
  • Schlötter tin
  • Atotech Cuprapulse® XP8 – pulsed copper plating, ( aspect ratio above 1:12)
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* The equipment was co-financed under a call for proposals from the Slovenian Enterprise 
Fund (Co-financing of new technological equipment in 2013-2014).
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